NTMFS4935N
TYPICAL CHARACTERISTICS
4500
4000
3500
3000
C iss
V GS = 0 V
T J = 25 ° C
11
10
9
8
7
QT
2500
6
2000
1500
1000
500
0
0
5
10
C oss
C rss
15
20
25
30
5
4
3
2
1
0
0
Qgs
5
Qgd
10
15
20
25
30
35
T J = 25 ° C
V DD = 15 V
V GS = 10 V
I D = 30 A
40 45
50
1000
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
30
Qg, TOTAL GATE CHARGE (nC)
Figure 8. Gate ? to ? Source and
Drain ? to ? Source Voltage vs. Total Charge
100
V DD = 15 V
I D = 15 A
V GS = 10 V
t d(off)
t f
t r
t d(on)
25
20
15
V GS = 0 V
T J = 125 ° C
10
10
5
T J = 25 ° C
1
1
10
100
0
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1000
R G , GATE RESISTANCE ( W )
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
130
V SD , SOURCE ? TO ? DRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
100
10
10 m s
100 m s
1 ms
120
110
100
90
80
70
I D = 29 A
1
0.1
0.01
0.01
0 ≤ V GS ≤ 20 V
Single Pulse
T C = 25 ° C
R DS(on) Limit
Thermal Limit
Package Limit
0.1
1
10
10 ms
dc
100
60
50
40
30
20
10
0
25
50
75
100
125
150
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
http://onsemi.com
5
T J , STARTING JUNCTION TEMPERATURE ( ° C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
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